$5,000,000+
Inventory Delivered By
Name:
In stock - Ready to Ship
3 Year Extended Warranty
Same-day Shipping
14-Day Money Back Guarantee
Shipping:
Payment:
3 Year Extended Warranty
Same-day Shipping
14-Day Money Back Guarantee
Need Additional Discount on Product?
Request a quote below - Get Exclusive Pricing and Support.
Shipping:
Payment:
840387-L21
HPE DL560 Gen10 Xeon-Gold 6152 (2.1GHz/22-core/135W) FIO Pro...
TRUSTED, TRIED, PROVEN
Inventory Delivered By
& Verified By
Solutions Powered By
840387-L21 is a high-performance processor from Intel featuring the Intel Core series with 13th Gen Raptor Lake architecture designed for the LGA 1700 socket. It comes equipped with 16 cores and 24 threads, a base clock speed of 3.4 GHz that can boost up to 5.4 GHz, 16 MB of L2 cache and 30 MB of L3 cache, and a thermal design power (TDP) of 125W.
This unlocked processor supports overclocking and is optimized for demanding gaming and workstation applications. It integrates Intel UHD Graphics 770 with a graphics base frequency of 350 MHz and a max dynamic frequency of 1450 MHz, supports both DDR4 and DDR5 memory in a dual-channel configuration, offers PCIe 5.0 connectivity, and is compatible with chipsets aligned to Intel’s platform requirements.
840387-L21 price is is available on request. Get immediate quote.
Request bulk order quote for 840387-L21 for additional pricing. Browse the full Hpe Dl560 Server Processors series or explore all Hpe products.
Deploying the 840387-L21 HPE DL560 Gen10 with Xeon-Gold 6152 (2.1 GHz/22-core/135 W) FIO Processor Kit in an enterprise virtualization cluster enables consolidation of up to 250 VMs per chassis. By leveraging 88 physical cores across four sockets, IT teams reduce rack-space requirements by 40% and slash power consumption by 30%. The outcome is a 2× increase in VM density, simplified capacity planning and a 20% reduction in TCO, all while maintaining SLAs for mixed-workload environments.
Integrating the Xeon-Gold 6152 FIO Processor Kit into HPE DL560 Gen10 servers accelerates in-memory processing for Apache Spark pipelines. In an IoT data-ingestion scenario, organizations achieve sub-second query response times on 50+ billion daily events. The result is a 60% uplift in throughput, real-time dashboards for operational intelligence and a scalable analytics platform that supports 5-year data-growth projections without additional hardware investment.
Equipping SAP HANA and Oracle RAC clusters with the 840387-L21 Xeon-Gold 6152 FIO Processor Kit delivers sustained transaction rates above 20,000 TPS per node. Four-socket NUMA optimization and 22-core parallelism minimize latency under peak load. Enterprises realize 99.99% availability, 35% faster backup times and a 25% improvement in query concurrency—ensuring superior user experience for finance, retail and supply-chain applications.
To get the detailed certification, please go to the Compliance Center.
| Product Type | Processors | Processors | Processors | Processors | Processors |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Series | Intel Core | Intel Core | Intel Core | Intel Core | Intel Core |
| Category | Desktop | Desktop | Desktop | Desktop | Desktop |
| Max Memory Support | 128 GB | 128 GB | 128 GB | 128 GB | 128 GB |
| Memory Type Support | DDR4 & DDR5 | DDR4 & DDR5 | DDR5 | DDR4 & DDR5 | DDR4 & DDR5 |
| Generation | Intel 13th Gen | Intel 13th Gen | Intel 13th Gen | Intel 13th Gen | Intel 13th Gen |
| Architecture | Raptor Lake | Raptor Lake | Raptor Lake | Raptor Lake | Raptor Lake |
| ECC Support | No | No | No | No | No |
| Security Features | None | N/A | None | None | SGX |
| CPU Socket | LGA 1700 | LGA 1700 | LGA 1700 | LGA 1700 | LGA 1700 |
| Instruction Set Extensions | AVX2 | AVX2 | AVX2 | AVX-512 | AVX2 |
| Virtualization Support | Intel VT-x | Intel VT-x | Intel VT-x | Intel VT-x | Intel VT-x |
| Cores | 16 | 8 | 8 | 16 | 8 |
| Threads | 24 | 16 | 16 | 24 | 16 |
| Base Clock | 3.4 GHz | 3.2 GHz | 3.6 GHz | 3.4 GHz | 3.6 GHz |
| Max Boost Clock | 5.4 GHz | 4.8 GHz | 5.0 GHz | 5.4 GHz | 5.0 GHz |
| Overclocking Support | Yes | Yes | Yes | Yes | Yes |
| L2 Cache | 16 MB | 4 MB | 8 MB | 16 MB | 4 MB |
| L3 Cache | 30 MB | 16 MB | 16 MB | 30 MB | 16 MB |
| TDP | 125W | 125W | 125W | 125W | 125W |
| Integrated Graphics | Intel UHD Graphics 770 | Intel UHD Graphics 770 | Intel UHD Graphics 770 | Intel UHD Graphics 770 | Intel UHD Graphics 770 |
| Graphics Base Frequency | 350 MHz | 350 MHz | 350 MHz | 350 MHz | 350 MHz |
| Graphics Max Dynamic Frequency | 1450 MHz | 1300 MHz | 1100 MHz | 1300 MHz | 1100 MHz |
| Memory Channels | Dual | Dual | Dual | Dual | Dual |
| PCIe Version | PCIe 5.0 | PCIe 5.0 | PCIe 5.0 | PCIe 5.0 | PCIe 5.0 |
| Unlocked | Yes | Yes | Yes | Yes | Yes |
| Cooler Included | No | No | No | No | No |
| Use Case | Gaming / Overclocking | Gaming | Gaming | Gaming | Gaming |
| Product Name | Intel Core i7-13700K | Intel Core i7-13700K | Intel Core i7-12700K | Intel Core i7-13700K (P07148-B21) | Intel Core i7-13700K Processor (840399-B21) |
| Height | 0.13 inches | 0.5 inches | 0.5 inches | 1.5 inches | 0.6 inches |
| Width | 1.52 inches | 1.5 inches | 1.3 inches | 1.5 inches | 1.5 inches |
| Depth | 1.52 inches | 1.5 inches | 1.3 inches | 0.1 inches | 1.5 inches |
| Weight | 0.25 lbs | 0.3 lbs | 0.25 lbs | 0.2 lbs | 0.3 lbs |
Xeon Gold 6152 FIO integrates smoothly and performs reliably.
Stable performance under continuous load.
Deployment was straightforward.
Good choice for enterprise workloads.
Predictable results.
The HPE DL560 Gen10 Xeon-Gold 6152 FIO Processor Kit is a factory-integrated upgrade option for ProLiant DL560 Gen10 servers, featuring a 22-core Intel Xeon Gold 6152 CPU running at 2.1 GHz with a 135 W thermal design power.
The Intel Xeon-Gold 6152 in this kit provides 22 physical cores and 44 threads, delivering high concurrency for virtualization, databases, and analytics.
The Xeon-Gold 6152 operates at a base frequency of 2.1 GHz and can turbo boost up to 3.7 GHz under optimized thermal and power conditions.
This processor kit has a Thermal Design Power of 135 W, balancing performance with power efficiency in 2U rack environments.