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870976-L21
HPE DL360 Gen10 Xeon-P 8164 FIO Kit
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870976-L21 is an Intel processor from the Intel 13th Gen series based on the Raptor Lake architecture and designed for the LGA 1700 socket. It features 8 cores and 16 threads with a base clock speed of 3.8 GHz and a boost clock speed of 5.1 GHz, complemented by 4 MB of L2 cache and 16 MB of L3 cache. With a thermal design power of 125W, this chip includes Intel UHD Graphics 770, supports DDR4 & DDR5 memory in a dual-channel configuration at speeds up to 5200 MHz, utilizes PCIe 5.0, and offers overclocking support while being compatible with chipsets such as Z690 and Z790.
870976-L21 is engineered for high-performance computing with an emphasis on gaming and creative workstation applications. The processor’s unlocked nature allows enthusiasts to push performance boundaries, while its advanced architectural features and integrated graphics deliver reliable acceleration for multitasking and demanding workloads in both gaming and professional environments.
870976-L21 price is $9,907.65, a 16% saving from the Hpe list price of $11,794.82. 870976-L21 is in stock and available for next-day dispatch. (terms applied)
Request bulk order quote for 870976-L21 for additional pricing. Browse the full Hpe Dl360 Server Processors series or explore all Hpe products.
A global financial services firm deploys the HPE DL360 Gen10 Xeon-P 8164 FIO Kit to consolidate 500+ critical virtual machines into a single 2-socket server. By leveraging the kit’s high-core density and flexible I/O lanes, the IT team reduced rack-space consumption by 60% and cut power and cooling costs by 25%, while maintaining sub-millisecond VM response times and enterprise-grade SLAs.
A quantitative trading desk integrates the 870976-L21 HPE DL360 Gen10 Xeon-P 8164 FIO Kit into its low-latency analytics cluster. The upgraded CPU throughput and NVMe-optimized I/O deliver 2× faster data ingestion from market feeds and complete risk-model recalculations in under 200 ms, enabling traders to execute high-frequency strategies with sub-microsecond precision.
A university supercomputing center outfits its next-gen genomics pipeline with the HPE DL360 Gen10 Xeon-P 8164 FIO Kit to accelerate DNA sequencing analysis. The combined multi-thread parallelism and flexible I/O bandwidth shorten batch job runtimes by 40%, support scalable workflows across 1,000+ concurrent cores, and deliver results in hours instead of days.
To get the detailed certification, please go to the Compliance Center.
| Product Type | Processors | Processors | Processors | Processors | Processors |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Series | Intel Core | Intel Core | Intel Core | Intel Core | Intel Core |
| Category | Desktop | Desktop | Desktop | Desktop | Desktop |
| Max Memory Support | 128 GB | 128 GB | 128 GB | 128 GB | 128 GB |
| Memory Type Support | DDR4 & DDR5 | DDR4 | DDR4 & DDR5 | DDR4 | DDR5 |
| Generation | Intel 13th Gen | Intel 13th Gen | Intel 12th Gen | Intel 11th Gen | Intel 13th Gen |
| Architecture | Raptor Lake | Raptor Lake | Alder Lake | Rocket Lake | Raptor Lake |
| ECC Support | No | No | No | No | No |
| Security Features | SGX | SGX | None | None | SGX |
| CPU Socket | LGA 1700 | LGA 1700 | LGA 1700 | LGA 1200 | LGA 1700 |
| Instruction Set Extensions | AVX-512 | AVX2 | AVX2 | AVX2 | AVX2 |
| Virtualization Support | Intel VT-x | Intel VT-x | Intel VT-x | Intel VT-x | Intel VT-x / Intel VT-d |
| Cores | 8 | 8 | 8 | 8 | 8 |
| Threads | 16 | 16 | 16 | 16 | 16 |
| Base Clock | 3.8 GHz | 3.6 | 3.6 | 3.6 GHz | 3.6 |
| Max Boost Clock | 5.1 GHz | 5.0 | 4.8 | 4.8 GHz | 5.0 |
| Overclocking Support | Yes | Yes | Yes | Yes | No |
| L2 Cache | 4 MB | 8 | 4 | 4 | 4 |
| L3 Cache | 16 MB | 16 | 16 | 16 | 16 |
| TDP | 125W | 125W | 65W | 125W | 125W |
| Integrated Graphics | Intel UHD Graphics 770 | Intel UHD Graphics 770 | Intel UHD Graphics 770 | Intel UHD Graphics 770 | Intel UHD Graphics 770 |
| Graphics Base Frequency | 300 MHz | 350 | 350 | 300 MHz | 300 |
| Graphics Max Dynamic Frequency | 1150 MHz | 1150 | 1100 | 1150 MHz | 1200 |
| Memory Channels | Dual | Dual | Dual | Dual | Dual |
| PCIe Version | PCIe 5.0 | PCIe 5.0 | PCIe 5.0 | PCIe 4.0 | PCIe 5.0 |
| Unlocked | Yes | Yes | Yes | Yes | No |
| Cooler Included | No | No | No | No | Yes |
| Use Case | Gaming | Gaming | Gaming | Gaming / Workstation | Gaming |
| Product Name | Intel Core i7-13700K | Intel Core i7-13700K Processor | Intel Core i7 P02574-L21 | 860653-B21 Intel Rocket Lake Processor | Intel Core P02649-L21 |
| Height | 0.2 inches | 1.5 | 1.4 | 1.4 inches | N/A |
| Width | 1.5 inches | 0.8 | 1.4 | 3.5 inches | N/A |
| Depth | 1.5 inches | 1.2 | 0.2 | 3.5 inches | N/A |
| Weight | 0.1 lbs | 0.25 | 0.5 | 0.75 lbs | N/A |
High end Xeon delivers strong performance for enterprise workloads.
Thermals remain controlled even under heavy use.
Smooth installation experience.
Excellent compute density for virtualization.
Consistent production results.
The HPE DL360 Gen10 Xeon-P 8164 FIO Kit (870976-L21) is a factory-integrated option containing an Intel Xeon Platinum 8164 CPU, heatsink and retention kit for HPE ProLiant DL360 Gen10 servers.
It includes an Intel Xeon Platinum 8164 processor running at 3.0 GHz base frequency with up to 3.7 GHz turbo, 24 cores and 35.75 MB cache for compute-intensive workloads.
Yes, SKU 870976-L21 is validated for all HPE ProLiant DL360 Gen10 chassis and seamlessly integrates with existing system boards and firmware releases.
The kit includes an HPE-validated heatsink and retention assembly engineered for optimal thermal performance in 1U rack environments.