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CE8861-4C-EI-F

Description:
CE8861-4C-EI Mainframe(With 4 Subcard Slots,2*AC Power Module,2*FAN Box,Port-side Exhaust)
Rating:
4.3(6)
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Brand:
Huawei
GTIN:
886598007238gtin-tool-tip
Condition:
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ce8861-4c-ei-f ce8861-4c-ei mainframe(with 4 subcard slots,2*ac power module,2*fan box,port-side exhaust)
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CE8861-4C-EI-F

CE8861-4C-EI Mainframe(With 4 Subcard Slots,2*AC Power Modul...

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CE8861-4C-EI-F Overview

CE8861-4C-EI-F is a high-performance enterprise switch designed with a robust architecture that optimizes both scalability and efficiency. It integrates a reliable AC power supply option, supports advanced Layer 2 and Layer 3 routing, and features a rack-mount form factor that ensures seamless integration into modern data center and branch environments.

The switch offers a mix of high-speed copper and SFP ports streamlined for optimal stacking and performance. Designed to meet the demanding needs of scalable networks, CE8861-4C-EI-F delivers consistent throughput for mission-critical applications, making it ideal for enterprise campus deployments and high-density branch offices.

CE8861-4C-EI-F price is is available on request. Get immediate quote.

Request bulk order quote for CE8861-4C-EI-F for additional pricing. Browse the full Ce8800 Series series or explore all Huawei products.

CE8861-4C-EI-F Specifications

Product Type
Switch
Power Source
AC Power Supply
Layer Supported
Layer 2 / Layer 3
Form Factor
Rack-mount
Manageable
Managed
Ethernet Technology
10/100/1000
Media Type Supported
Twisted Pair
Redundant Power Supply Supported
No
Uplink Configuration
1G
POE Support
Non POE
SFP Ports
4 SFP Ports
Memory
256 MB
Rack Units
1 RU
Interface Ports
10/100/1000
Flash Memory
64 MB
Width
17.5 inches
Height
1.75 inches
Number of Downlink Ports
4 Ports
Switching Capacity
20 Gbps
Depth
11 inches
Number of Ethernet Ports
Under 12 Ports
Switching Capacity with Stacking
40 Gbps
IOS
IP Lite
Weight
8 lbs
Power Consumption
50W
Manufacturer Part Number
CE8861-4C-EI-F
Port/Expansion Slot Details
4 copper ports with integrated SFP uplink ports
Product Name
CE8861-4C-EI-F Enterprise Switch

Quality Certifications

To get the detailed certification, please go to the Compliance Center.

ISO 14001 Certified - UCCISO 9001 Certified - UCCRoHS CompliantREACH CompliantFCC CertifiedCE Mark - European ConformityVCI CertifiedUKCA Mark - UK Conformity Assessed

Product Comparison Table

CE8861-4C-EI Mainframe(With 4 Subcard Slots,2*AC Power Module,2*FAN Box,Port-side Exhaust)CE8861-4C-EI-FCE8850-32CQ-EI Switch(32-Port 100GE QSFP28,2-Port 10GE SFP+,2*AC Power Module,2*FAN Box,Port-side Intake)CE8850-EI-B-B0ACE8861-4C-EI Mainframe(With 4 Subcard Slots,2*AC Power Module,2*FAN Box,Port-side Intake)CE8861-4C-EI-BCE8861-4C-EI Mainframe(With 4 Subcard Slots,Without FAN Box,Without Power Module)CE8861-4C-EICE8850-32CQ-EI Switch(32-Port 100GE QSFP28,2-Port 10GE SFP+,Without Fan and Power Module)CE8850-32CQ-EI
Depth11 inches12 inches18 inches14 inches17 inches
Ethernet Technology10/100/100010/100/100010/100/100010/100/100010/100/1000
Flash Memory64 MB256 MB64 MB64 MB64 MB
Form FactorRack-mountRack-mountRack-mountRack-mountRack-mount
Height1.75 inches1 inch1.75 inches1.75 inches1.75 inches
IOSIP LiteIP ServicesIP ServicesLAN LiteIP Services
Interface Ports10/100/100010/100/100010/100/100010/100/100010/100/1000
Layer SupportedLayer 2 / Layer 3Layer 2 / Layer 3Layer 3Layer 2 / Layer 3Layer 2 / Layer 3
ManageableManagedManagedManagedManagedManaged
Manufacturer Part NumberCE8861-4C-EI-FCE8850-EI-B-B0ACE8861-4C-EI-BCE8861-4C-EICE8850-32CQ-EI
Media Type SupportedTwisted PairTwisted Pair / FiberComboComboTwisted Pair / Fiber / Combo
Memory256 MB512 MB256 MB256 MB256 MB
Number of Downlink Ports4 Ports24 Ports24 Ports8 Ports32 Ports
Number of Ethernet PortsUnder 12 Ports24–48 Ports24–48 PortsUnder 12 Ports24–48 Ports
POE SupportNon POEPOE+Non POENon POEPOE+
Port/Expansion Slot Details4 copper ports with integrated SFP uplink ports24 x Gigabit Ethernet ports, 4 x 10G SFP ports24 Gigabit Ethernet ports with 4 SFP uplink slots4 combo ports with integrated SFP uplink supportN/A
Power Consumption50W250W120W75 W150 W
Power SourceAC Power SupplyRedundant Power SupplyAC Power SupplyAC Power SupplyRedundant Power Supply
Product NameCE8861-4C-EI-F Enterprise SwitchEnterprise Integrated Switch CE8850-EI-B-B0ACE8861-4C-EI-B Gigabit Managed SwitchCE8861-4C-EI Enterprise SwitchCE8850-32CQ-EI Switch
Product TypeSwitchSwitchSwitchSwitchSwitch
Rack Units1 RU1 RU1 RU1 RU1 RU
Redundant Power Supply SupportedNoYesNoNoYes
SFP Ports4 SFP Ports4 SFP Ports4 SFP Ports4 SFP Ports4 SFP Ports
Switching Capacity20 Gbps176 Gbps120 Gbps128 Gbps128 Gbps
Switching Capacity with Stacking40 Gbps352 Gbps240 Gbps256 Gbps256 Gbps
Uplink Configuration1G10G10G1G10G
Weight8 lbs15 lbs15 lbs10 lbs15 lbs
Width17.5 inches17 inches17.5 inches17.5 inches17.5 inches

Reviews & Ratings

C
Caleb Wetherby
5

Port side exhaust chassis aligned perfectly with our airflow design.

T
Tristan Grantham
4

Reliable modular core platform with strong stability.

C
Colin Birchfield
5

Professional chassis for scalable fabric builds.

E
Ethan Stonebridge
3

Consistent operation and clean management experience.

M
Miles Kettering
4

Smooth installation and dependable uptime.

J
Jonah Aldridge
5

Excellent base for high bandwidth deployments.

Questions & Answers

What is the CE8861-4C-EI mainframe?

The CE8861-4C-EI mainframe is a high-performance networking chassis featuring 4 subcard slots, 2 AC power modules, 2 fan boxes, and port-side exhaust for enterprise-grade switching and routing.

How many subcard slots does the CE8861-4C-EI support?

The CE8861-4C-EI supports four hot-swappable subcard slots, allowing flexible expansion of line modules for uplink, aggregation, and service deployment.

What power modules are included in the CE8861-4C-EI mainframe?

This chassis includes two redundant AC power modules, delivering up to 1,440 W each, for uninterrupted operation and power-supply redundancy.

How does the port-side exhaust design improve cooling?

Port-side exhaust directs hot air away from line cards and subcards, optimizing airflow and thermal performance in high-density deployments.

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