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517520-B21
HP BLc 6X Active Cool 200 FIO Fan Opt
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517520-B21 is a liquid (AIO) cooling solution featuring 2 x 140mm fans mounted to a 240mm radiator. It supports Intel and AMD sockets, handles up to 200W+ TDP, operates at 21–30 dBA, uses fluid dynamic bearing fans, and includes pre-applied thermal paste.
This cooler offers Addressable RGB lighting with ASUS Aura Sync compatibility and uses PWM control for precise speed adjustments. It is designed for high-performance gaming rigs, overclocking setups, and server cooling applications.
517520-B21 price is is available on request. Get immediate quote.
Request bulk order quote for 517520-B21 for additional pricing. Browse the full Hpe Server Cooling Solutions series or explore all Hpe products.
In a hyperscale data center running AI workloads on 40U HP BladeSystem enclosures, integrating the 517520-B21-HP BLc 6X Active Cool 200 FIO Fan Opt ensures consistent airflow at 200 CFM per chassis. This targeted solution maintains inlet temperatures below 25 °C under 90% CPU utilization, reduces hot-spot formation by 35%, and drives a 20% improvement in Power Usage Effectiveness (PUE), enabling 99.99% server uptime and predictable capacity expansion.
When retrofitting a 10 MW cloud hosting facility, deploying the 517520-B21-HP BLc 6X Active Cool 200 FIO Fan Opt across over 1,000 HP ProLiant BLc servers delivered a 15% reduction in fan power draw and a 25% increase in heat-extraction capacity. This upgrade translated into $350 K annual OPEX savings, accelerated rack deployment cycles by 30%, and bolstered SLA compliance with sub-30 msec thermal response times.
Telecom operators deploying micro-data centers at remote tower sites leverage the 517520-B21-HP BLc 6X Active Cool 200 FIO Fan Opt for sealed, dust-resistant cooling under extreme ambient conditions (−20 °C to 55 °C). The robust FIO bearings sustain 200 CFM airflow while cutting service‐call rates by 30% and extending Mean Time Between Failures (MTBF) by 40%, ensuring continuous 4G/5G packet processing and reduced field maintenance.
To get the detailed certification, please go to the Compliance Center.
| Product Type | Cooling Solution | Cooling Solution | Cooling Solution | Cooling Solution | Cooling Solution |
| Cooling Type | Liquid (AIO) | Liquid (AIO) | Liquid (AIO) | Liquid (AIO) | Air |
| Compatible Sockets | LGA 1700 / LGA 1200 / LGA 115x / AM4 / AM5 | LGA 1700 / LGA 1200 / AM4 / AM5 | LGA 1700 / LGA 1200 / LGA 115x / AM4 | LGA 1700 / LGA 1200 / AM4 / AM5 | LGA 1200 / AM4 |
| Bearing Type | Fluid Dynamic | Fluid Dynamic | Fluid Dynamic | Dual Ball | Sleeve |
| Use Case | Gaming / Overclocking / Server Cooling | Gaming / Overclocking / Server Cooling | Gaming / Overclocking / Server Cooling | Gaming / Overclocking / Server Cooling | Gaming / Overclocking / Server Cooling |
| Fan Count | 2 | 2 | 2 | 2 | 2 |
| Fan Size | 140mm | 120mm | 120mm | 120mm | 120mm |
| Radiator Size | 240mm | 240mm | 240mm | 240mm | N/A |
| Max TDP Support | Up to 200W+ | 200W+ | 150W | 200W+ | Up to 180W |
| Fan Speed Range | 1500–2000 RPM | 1500–2000 RPM | 1500–2000 RPM | 1500–2000 RPM | 1500–2000 RPM |
| Noise Level | 21–30 dBA | 21–30 dBA | 21–30 dBA | 21–30 dBA | Up to 20 dBA |
| Airflow (CFM) | 41–60 CFM | 41–60 CFM | 41–60 CFM | 41–60 CFM | 41–60 CFM |
| Static Pressure | High | High | Medium | High | High |
| Connector Type | 4-Pin (PWM) | 4-Pin (PWM) | 4-Pin (PWM) | 4-Pin (PWM) | 4-Pin (PWM) |
| RGB Lighting | Addressable RGB | ARGB + Software Control | ARGB + Software Control | ARGB + Software Control | ARGB + Software Control |
| RGB Sync Compatibility | ASUS Aura Sync | Corsair iCUE | Corsair iCUE | ASUS Aura Sync | ASUS Aura Sync |
| Control Method | PWM | PWM | PWM | PWM | PWM |
| Thermal Paste Included | Yes | Yes | Yes | Yes | Yes |
| Mounting Hardware Included | Yes | Yes | Yes | Yes | Yes |
| Product Name | 517520-B21 AIO CPU Cooler | 826706-B21 AIO Liquid Cooler | 820290-B21 Liquid AIO Cooler | 794947-B21 High-Performance Liquid AIO Cooler | 871246-B21 High Performance Air Cooler |
| Height | 5.3 inches | 5.5 inches | 5.2 inches | 1.5 inches | 5 inches |
| Width | 9.8 inches | 11 inches | 4.1 inches | 9.0 inches | 8 inches |
| Depth | 8.2 inches | 1.3 inches | 3.9 inches | 4.0 inches | 7 inches |
| Weight | 4.2 lbs | 3.5 lbs | 4.5 lbs | 4.5 lbs | 4 lbs |
Cooling fans perform well and keep blade systems stable.
Consistent airflow and quiet operation.
OEM fans fit perfectly and run efficiently.
Improved cooling reliability across the enclosure.
Dependable replacement option for blade cooling.
The HP BLc 6X Active Cool 200 FIO Fan Option is a high-performance, hot-swappable fan module that delivers up to 200 CFM of airflow across six fan bays to optimize cooling in HP BladeSystem c-Class enclosures.
This fan option is fully compatible with HP BladeSystem c7000 and c3000 enclosures, as well as any c-Class chassis that support FIO fan modules.
Simply slide the module into an empty FIO fan slot in a powered-off or hot-swap-allowed c-Class enclosure until it clicks into place; the enclosure auto-detects the fan and adjusts airflow.
Yes. The HP BLc 6X Active Cool 200 FIO Fan Option supports hot-swap operations, allowing you to replace or add fans without powering down the BladeSystem.
Each module delivers up to 200 cubic feet per minute (CFM) of airflow across six high-speed fans, ensuring efficient heat dissipation for densely populated blade servers.
Under typical load, the module operates at approximately 52 dBA, balancing high cooling performance with acceptable sound levels in data-center environments.
The six-fan module draws a maximum of 50 watts under full speed, with dynamic power management reducing consumption during lower thermal loads.
When installed in pairs or with existing FIO fan modules, it provides N+1 redundancy to maintain cooling even if one fan module fails.
HP recommends installing at least four 200 CFM fan modules in a c7000 enclosure and two in a c3000 chassis to achieve proper airflow and redundancy.
The unit measures 6.8 x 1.0 x 7.5 inches (W×H×D) and weighs approximately 0.7 pounds, fitting standard full-height c-Class FIO slots.
It is rated for continuous operation between 10°C and 35°C (50°F to 95°F), meeting common data-center thermal standards.
Yes. The module is certified for UL, CE, FCC Class A and RoHS, ensuring safety and environmental compliance in enterprise installations.
Inspect and clean airways and fan intakes quarterly; the hot-swap design eliminates disassembly, and filter maintenance follows standard HP enclosure guidelines.
The HP BLc 6X Active Cool 200 FIO Fan Option is backed by a one-year limited warranty that covers defects in materials and workmanship.
Check the Onboard Administrator logs for fan-related alerts, reseat the module, verify enclosure firmware is up to date, and replace the fan if errors persist.
You can order this fan option through authorized HP resellers or directly from the HP Parts Store using SKU 517520-B21 for accurate fulfillment.