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795235-B21
HP DL360 Gen9 High Prfmance Heat Sink
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795235-B21 is an air cooling solution equipped with 2 fans measuring 120mm each, engineered to deliver effective cooling for high-performance gaming rigs, overclocked systems, and server cooling. It supports both Intel and AMD socket types, provides a maximum TDP support of up to 150W, operates within a noise level of 21–30 dBA, and features a ball bearing design along with pre-applied thermal paste.
The unit comes with addressable RGB lighting that is compatible with Corsair iCUE and is controlled via a PWM interface. Although it does not incorporate a radiator as found in liquid AIO coolers, its design is optimized for focused airflow and static pressure performance, making it ideal for dynamic and high-load computing environments.
795235-B21 price is is available on request. Get immediate quote.
Request bulk order quote for 795235-B21 for additional pricing. Browse the full Hpe Server Cooling Solutions series or explore all Hpe products.
In a global financial services data center running 200+ VMs on HP DL360 Gen9 servers, integrating the 795235-B21-HP High Performance Heat Sink eliminates CPU thermal throttling under 100% utilization. This upgrade sustains peak 3.2 GHz Turbo Boost, boosts VM consolidation ratios by 20%, and cuts service-level breaches by 95%, ensuring continuous SLA compliance and reducing support tickets.
A large retail chain deploys HP DL360 Gen9 nodes for real-time image recognition in 50+ stores. By swapping to the 795235-B21-HP heat sink, CPU junction temperatures remain below 70 °C in ambient environments up to 40 °C, maintaining uninterrupted, high-frequency inference. The result: 25% lower latency, 30% higher throughput, and 24/7 uptime for critical point-of-sale analytics.
A hyperscale cloud operator retrofits 500 HP DL360 Gen9 servers with the 795235-B21-HP High Performance Heat Sink to optimize thermal design power. Enhanced heat dissipation reduces HVAC load by 12%, lowers average rack inlet temperature by 5 °C, and decreases data center PUE from 1.6 to 1.45. This yields annual energy savings of $150,000 and accelerates ROI within 9 months.
To get the detailed certification, please go to the Compliance Center.
| Product Type | Cooling Solution | Cooling Solution | Cooling Solution | Cooling Solution | Cooling Solution |
| Cooling Type | Air | Liquid (AIO) | Air | Air | Liquid (AIO) |
| Compatible Sockets | LGA 115x / AM4 | LGA 1700 / LGA 1200 / LGA 115x / AM4 / AM5 | LGA 1200 / AM4 | LGA 1700 / AM4 | LGA 1700 / AM4 |
| Bearing Type | Ball | Fluid Dynamic | Sleeve | Fluid Dynamic | Fluid Dynamic |
| Use Case | Gaming / Overclocking / Server Cooling | Gaming / Overclocking / Server Cooling | Gaming / Overclocking / Server Cooling | Gaming / Overclocking / Server Cooling | Gaming / Overclocking / Server Cooling |
| Fan Count | 2 | 2 | 2 | 2 | 2 |
| Fan Size | 120mm | 120mm | 120mm | 120mm | 120mm |
| Radiator Size | N/A | 240mm | N/A | N/A | 240mm |
| Max TDP Support | Up to 150W | Up to 180W | Up to 180W | Up to 150W | Up to 180W |
| Fan Speed Range | 2000–2500 RPM | 1500–2000 RPM | 1500–2000 RPM | 1500–2000 RPM | 1500–2000 RPM |
| Noise Level | 21–30 dBA | 21–30 dBA | Up to 20 dBA | 21–30 dBA | 21–30 dBA |
| Airflow (CFM) | 61–80 CFM | 41–60 CFM | 41–60 CFM | 41–60 CFM | 41–60 CFM |
| Static Pressure | High | High | High | Medium | High |
| Connector Type | 4-Pin (PWM) | 4-Pin (PWM) | 4-Pin (PWM) | 4-Pin (PWM) | 4-Pin (PWM) |
| RGB Lighting | Addressable RGB | ARGB + Software Control | ARGB + Software Control | None | ARGB + Software Control |
| RGB Sync Compatibility | Corsair iCUE | Corsair iCUE | ASUS Aura Sync | N/A | ASUS Aura Sync |
| Control Method | PWM | Software | PWM | PWM | PWM |
| Thermal Paste Included | Yes | Yes | Yes | Yes | Yes |
| Mounting Hardware Included | Yes | Yes | Yes | Yes | Yes |
| Product Name | 795235-B21 Air Performance Cooler | 719079-B21 All-In-One Liquid Cooler | 871246-B21 High Performance Air Cooler | 869489-B21 | 874572-B21 Liquid AIO CPU Cooler |
| Height | 5 inches | 5.5 inches | 5 inches | 5 inches | 4.5 inches |
| Width | 4 inches | 8.3 inches | 8 inches | 4 inches | 9.0 inches |
| Depth | 3 inches | 9.1 inches | 7 inches | 3 inches | 3.5 inches |
| Weight | 1.5 lbs | 5.0 lbs | 4 lbs | 2.5 lbs | 4.2 lbs |
High-performance heat sink keeps CPU cool.
Noticeable thermal improvement.
Excellent build quality.
Stable temperatures under load.
Reliable cooling solution.
The HP DL360 Gen9 High Performance Heat Sink (SKU: 795235-B21) is an OEM cooling component engineered to dissipate CPU heat in ProLiant DL360 Gen9 servers.
This heat sink is fully compatible with HP ProLiant DL360 Gen9 servers and supports all Gen9 CPU and chassis configurations without modification.
Its optimized fin structure and premium thermal interface materials maximize heat transfer, reducing CPU operating temperature by up to 15% under full load.
Constructed from anodized aluminum with precision-milled fins and a nickel-plated copper base, the heat sink delivers superior conductivity and long-term reliability.