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Luke Fairbanks
5
High core processor handles heavy storage workloads well.
803317-L21
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HP Apollo 4200 Gen9 E5-2690v3 FIO Kit
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803317-L21
- Description:
- HP Apollo 4200 Gen9 E5-2690v3 FIO Kit
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803317-L21 Overview
803317-L21 is an Intel processor from the Intel 13th Gen family built on the Raptor Lake architecture with an LGA 1700 socket. It features 8 cores and 16 threads with a base clock of 3.6 GHz and a maximum boost clock of 5.0 GHz, paired with 4 MB of L2 cache and 24 MB of L3 cache. It has a thermal design power (TDP) of 95W and comes equipped with integrated Intel UHD Graphics 770.
This high-performance CPU supports DDR5 memory via dual channels and offers PCIe 5.0 connectivity, ensuring excellent bandwidth for next-generation graphics and devices. Designed for gaming and workstation applications, it supports overclocking and is compatible with Intel 600/700 series chipsets, making it ideal for users seeking both power and flexibility in desktop environments.
803317-L21 price is is available on request. Get immediate quote.
Request bulk order quote for 803317-L21 for additional pricing. Browse the full Hpe Apollo Servers Processors series or explore all Hpe products.
803317-L21 Specifications
- Product Type
- Processors
- Brand
- Intel
- Series
- Intel Core
- Category
- Desktop
- Max Memory Support
- 128 GB
- Memory Type Support
- DDR5
- Generation
- Intel 13th Gen
- Architecture
- Raptor Lake
- ECC Support
- No
- Security Features
- SGX
- CPU Socket
- LGA 1700
- Instruction Set Extensions
- AVX2
- Virtualization Support
- Intel VT-x
- Cores
- 8
- Threads
- 16
- Base Clock
- 3.6 GHz
- Max Boost Clock
- 5.0 GHz
- Overclocking Support
- Yes
- L2 Cache
- 4 MB
- L3 Cache
- 24 MB
- TDP
- 95W
- Integrated Graphics
- Intel UHD Graphics 770
- Graphics Base Frequency
- 350 MHz
- Graphics Max Dynamic Frequency
- 1100 MHz
- Memory Channels
- Dual
- PCIe Version
- PCIe 5.0
- Unlocked
- Yes
- Cooler Included
- No
- Use Case
- Gaming
- Product Name
- Intel Core i7-803317-L21
- Height
- 0.5 inches
- Width
- 1.5 inches
- Depth
- 1.5 inches
- Weight
- 0.3 lbs
803317-L21 Use Case
High-Performance Big Data Analytics with HP Apollo 4200 Gen9 FIO Kit
Scenario: A global financial services firm deploys the 803317-L21-HP Apollo 4200 Gen9 E5-2690v3 FIO Kit as the underlying storage engine for its Hadoop/Spark cluster. Benefit: Delivers sub-millisecond I/O latency and 2.5× higher throughput, enabling real-time risk analytics and accelerating trading decision cycles by 30%.
Enterprise Virtualization & Private Cloud Optimization
Scenario: An enterprise IT team integrates the 803317-L21-HP Apollo 4200 Gen9 E5-2690v3 FIO Kit into its VMware vSphere environment to host 200+ business-critical VMs on a single rack. Benefit: Achieves 50% greater VM density and 40% lower storage TCO, empowering rapid service provisioning and seamless workload mobility.
Genomic Sequencing Workflow Acceleration
Scenario: A biotech research center leverages the 803317-L21-HP Apollo 4200 Gen9 E5-2690v3 FIO Kit to power its high-throughput genome assembly pipeline. Benefit: Reduces end-to-end processing time by 60%, enabling fast variant calling and accelerating time-to-insight for personalized medicine initiatives.
Quality Certifications
To get the detailed certification, please go to the Compliance Center.
Product Comparison Table 
| 803317-L21 |  850310-B21 |  850298-B21 |  830722-L21 |  879587-B21 | |
|---|---|---|---|---|---|
| Product Type | Processors | Processors | Processors | Processors | Processors |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Series | Intel Core | Intel Core | Intel Core | Intel Core | Intel Core |
| Category | Desktop | Desktop | Desktop | Desktop | Desktop |
| Max Memory Support | 128 GB | 128 GB | 128 GB | 128 GB | 128 GB |
| Memory Type Support | DDR5 | DDR5 | DDR5 | DDR5 | DDR5 |
| Generation | Intel 13th Gen | Intel 13th Gen | Intel 13th Gen | Intel 13th Gen | Intel 13th Gen |
| Architecture | Raptor Lake | Raptor Lake | Raptor Lake | Raptor Lake | Raptor Lake |
| ECC Support | No | No | No | No | No |
| Security Features | SGX | SGX | SGX | None | SGX |
| CPU Socket | LGA 1700 | LGA 1700 | LGA 1700 | LGA 1700 | LGA 1700 |
| Instruction Set Extensions | AVX2 | AVX2 | AVX2 | AVX2 | AVX2 |
| Virtualization Support | Intel VT-x | Intel VT-x | Intel VT-x | Intel VT-x | Intel VT-x |
| Cores | 8 | 8 | 8 | 8 | 8 |
| Threads | 16 | 16 | 16 | 16 | 16 |
| Base Clock | 3.6 GHz | 3.8GHz | 3.8 | 3.6 GHz | 3.6 |
| Max Boost Clock | 5.0 GHz | 5.0GHz | 5.0 | 5.0 GHz | 5.0 |
| Overclocking Support | Yes | No | Yes | No | Yes |
| L2 Cache | 4 MB | 4MB | 4 | 4 MB | 4 |
| L3 Cache | 24 MB | 16MB | 16 | 16 MB | 24 |
| TDP | 95W | 125W | 125W | 65W | 95W |
| Integrated Graphics | Intel UHD Graphics 770 | Intel UHD Graphics 770 | Intel UHD Graphics 770 | Intel UHD Graphics 770 | Intel UHD Graphics 770 |
| Graphics Base Frequency | 350 MHz | 350MHz | 350 | 300 MHz | 350 |
| Graphics Max Dynamic Frequency | 1100 MHz | 1100MHz | 1200 | 1050 MHz | 1100 |
| Memory Channels | Dual | Dual | Dual | Dual | Dual |
| PCIe Version | PCIe 5.0 | PCIe 5.0 | PCIe 5.0 | PCIe 5.0 | PCIe 5.0 |
| Unlocked | Yes | No | Yes | No | Yes |
| Cooler Included | No | No | No | No | No |
| Use Case | Gaming | Gaming / Workstation | Gaming | Gaming | Gaming |
| Product Name | Intel Core i7-803317-L21 | Intel Core i7-13700 Processor (850310-B21) | 850298-B21 Processor | Intel Core i7-13700 Processor (830722-L21) | Intel Core i7-13700K |
| Height | 0.5 inches | 0.5in | 1.5 | 1.5 inches | 1.5 |
| Width | 1.5 inches | 1.5in | 1.5 | 1.2 inches | 3.5 |
| Depth | 1.5 inches | 1.5in | 1.5 | 1.1 inches | 3.0 |
| Weight | 0.3 lbs | 0.3lbs | 0.5 | 0.25 lbs | 0.8 |
Reviews & Ratings
A
Aamir Nazir
4
Noticeable performance improvement after upgrade.
L
Lars Bj'rn
4
Stable and reliable in production.
J
James Ritchie
5
Installation was straightforward.
R
Rauf Siddiqui
5
Consistent results across deployments.
Questions & Answers
What is the HP Apollo 4200 Gen9 E5-2690v3 FIO Kit?
The HP Apollo 4200 Gen9 E5-2690v3 FIO Kit (SKU 803317-L21) is a Field Install Option that upgrades your Apollo 4200 Gen9 chassis with dual Intel Xeon E5-2690 v3 CPUs, heatsinks, rails, and all required mounting components for high-density storage servers.
What components are included in the HP 803317-L21 FIO Kit?
The kit includes two Intel Xeon E5-2690 v3 processors, two compatible thermal solutions (heatsinks), CPU carrier rails, mounting brackets, and installation instructions.
Which HP Apollo 4200 Gen9 server models are compatible with SKU 803317-L21?
This FIO Kit is compatible with all HP Apollo 4200 Gen9 storage server chassis featuring the Gen9 system board with dual CPU sockets.
How do I install the HP Apollo 4200 Gen9 E5-2690v3 FIO Kit?
Power down the server, remove existing blanking plates, insert the E5-2690 v3 CPUs into the dual sockets, secure the heatsinks, attach the rails per the guide, then power on and update BIOS settings.
What performance improvements can I expect after installing the E5-2690v3 FIO Kit?
You can achieve up to 20% higher compute performance, increased memory bandwidth, and greater virtualization density thanks to the 12-core, 2.6 GHz Intel Xeon E5-2690 v3 processors.
Can I use this FIO Kit with VMware ESXi or Microsoft Hyper-V?
Yes, the Intel Xeon E5-2690 v3 processors are certified for VMware vSphere and Microsoft Hyper-V on the HP Apollo 4200 Gen9 platform.
What power consumption does the Intel Xeon E5-2690v3 kit require?
Each E5-2690 v3 CPU has a thermal design power (TDP) of 135W, so the kit adds up to 270W in CPU power plus approximately 30W for associated cooling.
Does SKU 803317-L21 include a warranty?
Yes, it carries HP’s standard 3-year limited warranty, covering parts, labor, and on-site support to ensure continuous operation.
How can I order replacement parts for the FIO Kit?
Contact your authorized HP reseller or visit the HP support portal, reference SKU 803317-L21, and place a direct parts order.
What memory configurations are supported with the E5-2690v3 FIO Kit?
The server supports up to 768 GB of DDR4 RDIMM across 12 DIMM slots at speeds up to 2133 MT/s when using the E5-2690 v3 processors.
Can I add additional storage drives after installing the FIO Kit?
Yes, the Apollo 4200 Gen9 chassis supports up to 84 drive bays independently of the CPU kit, allowing seamless storage expansion.
Is remote management supported with this FIO Kit?
Yes, the kit integrates with HP iLO management for remote firmware updates, health monitoring, and proactive alerts.
What are the ideal use cases for the HP Apollo 4200 Gen9 E5-2690v3 FIO Kit?
It’s ideal for high-density object and block storage, Big Data analytics, backup/archive solutions, and software-defined storage clusters.
How does this kit enhance high-performance computing (HPC) workloads?
The dual 12-core Intel Xeon E5-2690 v3 CPUs deliver high parallel processing throughput, reducing compute times for simulations, data mining, and genomics.
What cooling requirements should I consider for the FIO Kit?
Ensure proper airflow in the 4U chassis with high-CFM fans and maintain ambient temperatures between 10 °C and 35 °C per HP’s thermal specifications.
What is the typical lead time for delivery of the HP Apollo 4200 Gen9 E5-2690v3 FIO Kit?
Standard lead times range from 3 to 5 business days for in-stock items, though this may vary by region and distributor availability.