Name:
803317-L21
- Description:
- HP Apollo 4200 Gen9 E5-2690v3 FIO Kit
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3 Year Extended Warranty
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803317-L21 Overview
803317-L21 is an Intel processor from the Intel 13th Gen family built on the Raptor Lake architecture with an LGA 1700 socket. It features 8 cores and 16 threads with a base clock of 3.6 GHz and a maximum boost clock of 5.0 GHz, paired with 4 MB of L2 cache and 24 MB of L3 cache. It has a thermal design power (TDP) of 95W and comes equipped with integrated Intel UHD Graphics 770.
This high-performance CPU supports DDR5 memory via dual channels and offers PCIe 5.0 connectivity, ensuring excellent bandwidth for next-generation graphics and devices. Designed for gaming and workstation applications, it supports overclocking and is compatible with Intel 600/700 series chipsets, making it ideal for users seeking both power and flexibility in desktop environments.
What is the price of 803317-L21?
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803317-L21 Specifications
| Product Type | Processors |
| Brand | Intel |
| Series | Intel Core |
| Category | Desktop |
| Max Memory Support | 128 GB |
| Memory Type Support | DDR5 |
| Generation | Intel 13th Gen |
| Architecture | Raptor Lake |
| ECC Support | No |
| Security Features | SGX |
| CPU Socket | LGA 1700 |
| Instruction Set Extensions | AVX2 |
| Virtualization Support | Intel VT-x |
| Cores | 8 |
| Threads | 16 |
| Base Clock | 3.6 GHz |
| Max Boost Clock | 5.0 GHz |
| Overclocking Support | Yes |
| L2 Cache | 4 MB |
| L3 Cache | 24 MB |
| TDP | 95W |
| Integrated Graphics | Intel UHD Graphics 770 |
| Graphics Base Frequency | 350 MHz |
| Graphics Max Dynamic Frequency | 1100 MHz |
| Memory Channels | Dual |
| PCIe Version | PCIe 5.0 |
| Unlocked | Yes |
| Cooler Included | No |
| Use Case | Gaming |
| Product Name | Intel Core i7-803317-L21 |
| Height | 0.5 inches |
| Width | 1.5 inches |
| Depth | 1.5 inches |
| Weight | 0.3 lbs |
803317-L21 Use Case
High-Performance Big Data Analytics with HP Apollo 4200 Gen9 FIO Kit
Scenario: A global financial services firm deploys the 803317-L21-HP Apollo 4200 Gen9 E5-2690v3 FIO Kit as the underlying storage engine for its Hadoop/Spark cluster. Benefit: Delivers sub-millisecond I/O latency and 2.5× higher throughput, enabling real-time risk analytics and accelerating trading decision cycles by 30%.
Enterprise Virtualization & Private Cloud Optimization
Scenario: An enterprise IT team integrates the 803317-L21-HP Apollo 4200 Gen9 E5-2690v3 FIO Kit into its VMware vSphere environment to host 200+ business-critical VMs on a single rack. Benefit: Achieves 50% greater VM density and 40% lower storage TCO, empowering rapid service provisioning and seamless workload mobility.
Genomic Sequencing Workflow Acceleration
Scenario: A biotech research center leverages the 803317-L21-HP Apollo 4200 Gen9 E5-2690v3 FIO Kit to power its high-throughput genome assembly pipeline. Benefit: Reduces end-to-end processing time by 60%, enabling fast variant calling and accelerating time-to-insight for personalized medicine initiatives.
Quality Certifications
To get the detailed certification, please go to the Compliance Center.
Product Comparison Table
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| Architecture | Raptor Lake | Raptor Lake | Raptor Lake | Raptor Lake | Raptor Lake |
| Base Clock | 3.8 | 3.6 GHz | 3.6 | 3.6 GHz | 3.8GHz |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Category | Desktop | Desktop | Desktop | Desktop | Desktop |
| Cooler Included | No | No | No | No | No |
| Cores | 8 | 8 | 8 | 8 | 8 |
| CPU Socket | LGA 1700 | LGA 1700 | LGA 1700 | LGA 1700 | LGA 1700 |
| Depth | 1.5 | 1.1 inches | 3.0 | 1.5 inches | 1.5in |
| ECC Support | No | No | No | No | No |
| Generation | Intel 13th Gen | Intel 13th Gen | Intel 13th Gen | Intel 13th Gen | Intel 13th Gen |
| Graphics Base Frequency | 350 | 300 MHz | 350 | 350 MHz | 350MHz |
| Graphics Max Dynamic Frequency | 1200 | 1050 MHz | 1100 | 1100 MHz | 1100MHz |
| Height | 1.5 | 1.5 inches | 1.5 | 0.5 inches | 0.5in |
| Instruction Set Extensions | AVX2 | AVX2 | AVX2 | AVX2 | AVX2 |
| Integrated Graphics | Intel UHD Graphics 770 | Intel UHD Graphics 770 | Intel UHD Graphics 770 | Intel UHD Graphics 770 | Intel UHD Graphics 770 |
| L2 Cache | 4 | 4 MB | 4 | 4 MB | 4MB |
| L3 Cache | 16 | 16 MB | 24 | 24 MB | 16MB |
| Max Boost Clock | 5.0 | 5.0 GHz | 5.0 | 5.0 GHz | 5.0GHz |
| Max Memory Support | 128 GB | 128 GB | 128 GB | 128 GB | 128 GB |
| Memory Channels | Dual | Dual | Dual | Dual | Dual |
| Memory Type Support | DDR5 | DDR5 | DDR5 | DDR5 | DDR5 |
| Overclocking Support | Yes | No | Yes | Yes | No |
| PCIe Version | PCIe 5.0 | PCIe 5.0 | PCIe 5.0 | PCIe 5.0 | PCIe 5.0 |
| Product Name | 850298-B21 Processor | Intel Core i7-13700 Processor (830722-L21) | Intel Core i7-13700K | Intel Core i7-803317-L21 | Intel Core i7-13700 Processor (850310-B21) |
| Product Type | Processors | Processors | Processors | Processors | Processors |
| Security Features | SGX | None | SGX | SGX | SGX |
| Series | Intel Core | Intel Core | Intel Core | Intel Core | Intel Core |
| TDP | 125W | 65W | 95W | 95W | 125W |
| Threads | 16 | 16 | 16 | 16 | 16 |
| Unlocked | Yes | No | Yes | Yes | No |
| Use Case | Gaming | Gaming | Gaming | Gaming | Gaming / Workstation |
| Virtualization Support | Intel VT-x | Intel VT-x | Intel VT-x | Intel VT-x | Intel VT-x |
| Weight | 0.5 | 0.25 lbs | 0.8 | 0.3 lbs | 0.3lbs |
| Width | 1.5 | 1.2 inches | 3.5 | 1.5 inches | 1.5in |
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Questions & Answers
Q
What is the HP Apollo 4200 Gen9 E5-2690v3 FIO Kit?
A
The HP Apollo 4200 Gen9 E5-2690v3 FIO Kit (SKU 803317-L21) is a Field Install Option that upgrades your Apollo 4200 Gen9 chassis with dual Intel Xeon E5-2690 v3 CPUs, heatsinks, rails, and all required mounting components for high-density storage servers.
Q
What components are included in the HP 803317-L21 FIO Kit?
A
The kit includes two Intel Xeon E5-2690 v3 processors, two compatible thermal solutions (heatsinks), CPU carrier rails, mounting brackets, and installation instructions.
Q
Which HP Apollo 4200 Gen9 server models are compatible with SKU 803317-L21?
A
This FIO Kit is compatible with all HP Apollo 4200 Gen9 storage server chassis featuring the Gen9 system board with dual CPU sockets.
Q
How do I install the HP Apollo 4200 Gen9 E5-2690v3 FIO Kit?
A
Power down the server, remove existing blanking plates, insert the E5-2690 v3 CPUs into the dual sockets, secure the heatsinks, attach the rails per the guide, then power on and update BIOS settings.
Q
What performance improvements can I expect after installing the E5-2690v3 FIO Kit?
A
You can achieve up to 20% higher compute performance, increased memory bandwidth, and greater virtualization density thanks to the 12-core, 2.6 GHz Intel Xeon E5-2690 v3 processors.
Q
Can I use this FIO Kit with VMware ESXi or Microsoft Hyper-V?
A
Yes, the Intel Xeon E5-2690 v3 processors are certified for VMware vSphere and Microsoft Hyper-V on the HP Apollo 4200 Gen9 platform.
Q
What power consumption does the Intel Xeon E5-2690v3 kit require?
A
Each E5-2690 v3 CPU has a thermal design power (TDP) of 135W, so the kit adds up to 270W in CPU power plus approximately 30W for associated cooling.
Q
Does SKU 803317-L21 include a warranty?
A
Yes, it carries HP’s standard 3-year limited warranty, covering parts, labor, and on-site support to ensure continuous operation.
Q
How can I order replacement parts for the FIO Kit?
A
Contact your authorized HP reseller or visit the HP support portal, reference SKU 803317-L21, and place a direct parts order.
Q
What memory configurations are supported with the E5-2690v3 FIO Kit?
A
The server supports up to 768 GB of DDR4 RDIMM across 12 DIMM slots at speeds up to 2133 MT/s when using the E5-2690 v3 processors.
Q
Can I add additional storage drives after installing the FIO Kit?
A
Yes, the Apollo 4200 Gen9 chassis supports up to 84 drive bays independently of the CPU kit, allowing seamless storage expansion.
Q
Is remote management supported with this FIO Kit?
A
Yes, the kit integrates with HP iLO management for remote firmware updates, health monitoring, and proactive alerts.
Q
What are the ideal use cases for the HP Apollo 4200 Gen9 E5-2690v3 FIO Kit?
A
It’s ideal for high-density object and block storage, Big Data analytics, backup/archive solutions, and software-defined storage clusters.
Q
How does this kit enhance high-performance computing (HPC) workloads?
A
The dual 12-core Intel Xeon E5-2690 v3 CPUs deliver high parallel processing throughput, reducing compute times for simulations, data mining, and genomics.
Q
What cooling requirements should I consider for the FIO Kit?
A
Ensure proper airflow in the 4U chassis with high-CFM fans and maintain ambient temperatures between 10 °C and 35 °C per HP’s thermal specifications.
Q
What is the typical lead time for delivery of the HP Apollo 4200 Gen9 E5-2690v3 FIO Kit?
A
Standard lead times range from 3 to 5 business days for in-stock items, though this may vary by region and distributor availability.