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860655-L21
- Description:
- HPE DL360 Gen10 Xeon-S 4108 FIO Kit
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3 - List Price:
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$889.14
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$746.88
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If a hardware issue is confirmed, we’ll repair or replace the unit. Replacement parts carry either original or 3-month coverage.
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Once an RMA is approved, return the defective unit within 10 days. We handle the rest — no service gaps.
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860655-L21
HPE DL360 Gen10 Xeon-S 4108 FIO Kit
$889.14
$746.88
39 in Global Warehouse
$746.88
16% off
TRUSTED, TRIED, PROVEN
860655-L21 Overview
860655-L21 is an AMD Ryzen 7 3700X processor delivering high performance tailored for demanding gaming, workstation, and creative applications. Based on the Ryzen 3000 Series and built on AMD’s Zen 2 architecture, this chip features 8 cores and 16 threads, operates with a base clock speed of 3.6 GHz and a boost clock speed of 4.4 GHz, and is housed in the AM4 socket for broad platform compatibility with AMD motherboards.
Engineered for efficient multitasking, it offers 4 MB of L2 cache and 32 MB of L3 cache, while maintaining a balanced 65W TDP with an unlocked design for overclocking. With support for DDR4 memory in a dual-channel setup and the PCIe 4.0 interface, the Ryzen 7 3700X—sold under the code 860655-L21—delivers no integrated graphics, making it ideal for users who pair it with dedicated graphics solutions.
What is the price of 860655-L21?
Lowest price of 860655-L21 is $ 746.88. Shop now! Get further exclusive discounts with bulk quotation on 860655-L21
Explore more options from Cpus And Processors or explore other Hpe products.
860655-L21 Specifications
| Product Type | Processors |
| Brand | AMD |
| Series | AMD Ryzen |
| Category | Desktop |
| Max Memory Support | 128 GB |
| Memory Type Support | DDR4 |
| Generation | Ryzen 3000 Series |
| Architecture | Zen 2 |
| ECC Support | No |
| Security Features | None |
| CPU Socket | AM4 |
| Instruction Set Extensions | AVX2 |
| Virtualization Support | AMD-V |
| Cores | 8 |
| Threads | 16 |
| Base Clock | 3.6 |
| Max Boost Clock | 4.4 |
| Overclocking Support | Yes |
| L2 Cache | 4 |
| L3 Cache | 32 |
| TDP | 65W |
| Integrated Graphics | None |
| Graphics Base Frequency | N/A |
| Graphics Max Dynamic Frequency | N/A |
| Memory Channels | Dual |
| PCIe Version | PCIe 4.0 |
| Unlocked | Yes |
| Cooler Included | Yes |
| Use Case | Gaming |
| Product Name | AMD Ryzen 7 3700X |
| Height | N/A |
| Width | N/A |
| Depth | N/A |
| Weight | N/A |
860655-L21 Use Case
Enterprise Virtualization & Consolidation with 860655-L21-HPE DL360 Gen10 Xeon-S 4108 FIO Kit
A mid-size IT department consolidates 50+ virtual machines for ERP, CRM and file services onto two HPE DL360 Gen10 servers equipped with the 860655-L21 FIO Kit. By leveraging the Intel Xeon-S 4108 processors and integrated NVMe front-I/O, the solution delivers 40% higher VM density, reduces rack footprint by 30%, and cuts power consumption—streamlining management and lowering total cost of ownership.
Accelerated SQL Database Performance for Retail Transactions
A national retail chain deploys the 860655-L21-HPE DL360 Gen10 Xeon-S 4108 FIO Kit to power its enterprise SQL cluster handling real-time inventory and POS transactions. The front-I/O optimized NVMe architecture drives sub-millisecond I/O latency, doubling transaction throughput and ensuring consistent performance during peak shopping hours, while enabling rapid data replication and high-availability failover.
Secure, High-Performance Edge Computing at Remote Sites
A financial services firm installs HPE DL360 Gen10 servers with the 860655-L21 FIO Kit at 20 remote branches to host local caching, virtualization and security services. The Xeon-S 4108-powered nodes deliver enterprise-grade compute and storage in 1U density, enabling sub-millisecond response for client apps, centralized management via HPE OneView, and encrypted data at rest—reducing WAN dependency and enhancing regulatory compliance.
Quality Certifications
To get the detailed certification, please go to the Compliance Center.
Product Comparison Table
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|---|---|---|---|---|---|
| Architecture | Zen 2 | Raptor Lake | Raptor Lake | Raptor Lake | Raptor Lake |
| Base Clock | 3.6 | 3.6 | 3.8 GHz | 3.6 | 3.6 GHz |
| Brand | AMD | Intel | Intel | Intel | Intel |
| Category | Desktop | Desktop | Desktop | Desktop | Desktop |
| Cooler Included | Yes | No | No | No | No |
| Cores | 8 | 8 | 8 | 16 | 8 |
| CPU Socket | AM4 | LGA 1700 | LGA 1700 | LGA 1700 | LGA 1700 |
| Depth | N/A | 0.2 | N/A | 0.14 | 1.5 inches |
| ECC Support | No | No | No | No | No |
| Generation | Ryzen 3000 Series | Intel 13th Gen | Intel 13th Gen | Intel 13th Gen | Intel 13th Gen |
| Graphics Base Frequency | N/A | 350 | 350 MHz | 350 | 300 MHz |
| Graphics Max Dynamic Frequency | N/A | 1200 | 1200 MHz | 1200 | 1200 MHz |
| Height | N/A | 1.5 | N/A | 1.57 | 0.5 inches |
| Instruction Set Extensions | AVX2 | AVX2 | AVX2 | AVX2 | AVX2 |
| Integrated Graphics | None | Intel UHD Graphics 770 | Intel UHD Graphics 770 | Intel UHD Graphics 770 | Intel UHD Graphics 770 |
| L2 Cache | 4 | 4 | 4 MB | 2 | 4 MB |
| L3 Cache | 32 | 24 | 16 MB | 20 | 16 MB |
| Max Boost Clock | 4.4 | 5.0 | 5.0 GHz | 5.0 | 4.9 GHz |
| Max Memory Support | 128 GB | 128 GB | 128 GB | 128 GB | 128 GB |
| Memory Channels | Dual | Dual | Dual | Dual | Dual |
| Memory Type Support | DDR4 | DDR4 & DDR5 | DDR5 | DDR5 | DDR5 |
| Overclocking Support | Yes | Yes | Yes | Yes | Yes |
| PCIe Version | PCIe 4.0 | PCIe 5.0 | PCIe 5.0 | PCIe 5.0 | PCIe 5.0 |
| Product Name | AMD Ryzen 7 3700X | Intel Core i7-13700K | Intel Core i7 P02718-L21 | Intel Core i7-13700K Processor (P02613-B21) | P02670-L21 |
| Product Type | Processors | Processors | Processors | Processors | Processors |
| Security Features | None | None | None | None | SGX |
| Series | AMD Ryzen | Intel Core | Intel Core | Intel Core | Intel Core |
| TDP | 65W | 125W | 125W | 125W | 125W |
| Threads | 16 | 16 | 16 | 24 | 16 |
| Unlocked | Yes | Yes | Yes | Yes | Yes |
| Use Case | Gaming | Gaming | Gaming | Gaming | Gaming / Workstation |
| Virtualization Support | AMD-V | Intel VT-x | Intel VT-x | Intel VT-x | Intel VT-x / Intel VT-d |
| Weight | N/A | 0.5 | N/A | 0.35 | 0.3 lbs |
| Width | N/A | 1.5 | N/A | 1.57 | 1.5 inches |
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Questions & Answers
Q
What is the HPE DL360 Gen10 Xeon-S 4108 FIO Kit (SKU 860655-L21)?
A
The HPE DL360 Gen10 Xeon-S 4108 FIO Kit (SKU 860655-L21) is a factory integration option that upgrades ProLiant DL360 Gen10 servers with an Intel Xeon Silver 4108 processor, heatsink assembly and thermal interface.
Q
What components are included in the FIO Kit?
A
SKU 860655-L21 includes an Intel Xeon Silver 4108 8-core processor, HPE thermal solution (heatsink and TRI-NOS), assembly screws and factory-tested integration materials.
Q
What are the technical specifications of the Intel Xeon Silver 4108 processor?
A
Intel Xeon Silver 4108 features 8 cores, 16 threads, 1.8 GHz base clock, 3.0 GHz turbo, 11 MB cache and 85 W TDP, with support for DDR4-2400 memory.
Q
Is the FIO Kit compatible with all HPE ProLiant DL360 Gen10 servers?
A
The FIO Kit is fully compatible with HPE ProLiant DL360 Gen10 servers using LFF or SFF drive cages and system board revision 2.0 or higher.
Q
How does the Xeon-S 4108 improve server performance?
A
The Xeon-S 4108 delivers balanced multicore performance, higher memory bandwidth and enhanced virtualization efficiency for cloud and data center workloads.
Q
What are the installation requirements for this FIO Kit?
A
Installation requires a supported DL360 Gen10 chassis, powered-down system, proper ESD handling and guided placement of the CPU assembly into the LGA 3647 socket.
Q
Can I deploy dual processors using this FIO Kit in a DL360 Gen10?
A
The kit supports single-socket deployment. For a dual-CPU configuration, purchase a second FIO Kit and ensure your system board revision supports two CPUs.
Q
Which memory modules are supported with the Xeon Silver 4108?
A
It supports up to eight DDR4-2400 RDIMM or LRDIMM modules per processor, enabling high-speed memory access and optimal workload performance.
Q
What is the maximum memory capacity supported by the kit?
A
When fully populated, each CPU socket supports up to 1.5 TB of memory with eight 128 GB LRDIMM modules, totaling 3 TB in dual-socket systems.
Q
What thermal management solution is provided in the FIO Kit?
A
The integrated thermal interface and HPE heatsink maintain optimal CPU temperatures under maximum load with standard DL360 Gen10 airflow configurations.
Q
How does the kit enhance I/O performance in the server?
A
Factory-installed CPU and thermal hardware reduce I/O latency by improving signal integrity and ensuring optimal board trace impedance matching.
Q
Can I use this FIO Kit to upgrade an existing DL360 Gen10 configuration?
A
Yes, the FIO Kit can upgrade existing DL360 Gen10 servers by replacing the CPU, heatsink and thermal materials, ensuring seamless integration with firmware updates.
Q
What are the power and cooling requirements for the Xeon Silver 4108?
A
The Xeon Silver 4108 requires an 85 W power envelope and standard DL360 Gen10 cooling, typically supported by redundant FlexLOM power supplies and optimized airflow.
Q
Does the kit include warranty coverage and support services?
A
SKU 860655-L21 includes HPE’s standard limited warranty and access to HPE support services for hardware replacement and firmware updates.
Q
How can I order SKU 860655-L21 and what are the shipping options?
A
You can order SKU 860655-L21 through authorized HPE resellers or the HPE online store; shipping options include ground, expedited and international freight.
Q
Where can I find technical resources and manuals for the FIO Kit?
A
Technical resources, installation guides and firmware updates are available on the HPE Support Center website under the ProLiant DL360 Gen10 documentation section.
