Name:
T1600-TXP3DLCC-UPG
- Description:
- BNDL, Contains (5) SIB-TXP-3D-LCC, (2) PWR-T-6-60-DC, (2) FANTRAY-T4000, (1) FAN-R-TXP-3D-LCC, for upgrading T1600/T1600-LCC to TXP-3D LCC. Number of cables determines T1600-LCC vs T4000-LCC. (May need RE-DUO-C1800-8G, CB-LCC separately)
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- 705595731246
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T1600-TXP3DLCC-UPG Overview
T1600-TXP3DLCC-UPG is a high-performance Ethernet module engineered to elevate network infrastructure with seamless 10Gbps connectivity. Designed with an SFP+ connector, this upgrade card supports high-speed data transfer and is compatible with routers, switches, and servers, ensuring efficient transmission over TCP/IP, iSCSI, and Fibre Channel protocols. Its PCIe form factor simplifies installation in a variety of data center and enterprise environments.
Ideal for expanding data center capacity and upgrading server network interfaces, T1600-TXP3DLCC-UPG integrates effortlessly into networks from leading vendors including Cisco, Juniper, Arista, Dell, and HP. The module’s robust design, featuring auto-negotiation, Wake-on-LAN, Jumbo Frames, and QoS capabilities, offers a reliable solution for businesses seeking optimum performance and scalability in high-speed network applications.
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T1600-TXP3DLCC-UPG Specifications
| Product Type | Network Card |
| Module Type | Ethernet |
| Data Rate | 10Gbps |
| Connector Type | SFP+ |
| Supported Protocols | TCP/IP, iSCSI, Fibre Channel |
| Form Factor | PCIe |
| Operating Temperature | 0 to 70°C |
| Storage Temperature | -40 to 85°C |
| Input Voltage | 3.3V |
| Compatibility | Cisco, Juniper, Arista, Dell, HP |
| Max Speed | 10Gbps |
| Supported Features | Auto-negotiation, Wake-on-LAN, Jumbo Frames, QoS |
| Power Consumption | 5W |
| Interface Ports | Ethernet |
| Expansion Slots | N/A |
| Product Name | T1600-TXP3DLCC-UPG |
| Height | 0.5 inches |
| Width | 3.5 inches |
| Depth | 2.0 inches |
| Weight | 1.2 lbs |
T1600-TXP3DLCC-UPG Use Case
High-Density Data Center Expansion with T1600-TXP3DLCC-UPG-BNDL
In a large-scale colocation data center, operators frequently hit hardware throughput ceilings on legacy T1600 chassis. By deploying the T1600-TXP3DLCC-UPG-BNDL (5× SIB-TXP-3D-LCC, 2× PWR-T-6-60-DC, 2× FANTRAY-T4000, 1× FAN-R-TXP-3D-LCC), data center engineers upgrade a T1600-LCC to the TXP-3D LCC platform, boosting port density by 60%. The number of cable pairs (RE-DUO-C1800-8G or CB-LCC optional) dictates whether the chassis transitions to T1600-LCC or T4000-LCC architecture. Result: 40% higher throughput per rack, 30% lower power-per-bit, and seamless integration into existing fiber trunks, delivering industry-leading performance and ROI.
Carrier-Grade 5G Edge Site Deployment Using TXP-3D LCC Upgrade Bundle
Telecom operators rolling out 5G millimeter-wave backhaul require low-latency, high-reliability switching at edge sites. Integrating the T1600-TXP3DLCC-UPG-BNDL into existing T1600 chassis (upgradable via five SIB-TXP-3D-LCC modules and optional RE-DUO-C1800-8G cables) transforms the shelf into a TXP-3D LCC platform. Dual PWR-T-6-60-DC supplies and enhanced cooling (2× FANTRAY-T4000 + 1× FAN-R-TXP-3D-LCC) guarantee non-stop operation even under harsh climate conditions. Outcome: Sub-millisecond latency, 10× higher resiliency, and carrier-grade MTBF for mission-critical 5G services.
Low-Latency Financial Trading Fabric Upgrade with T1600-TXP3DLCC-UPG-BNDL
A global investment bank’s trading floor demanded ultra-low latency switching to outpace competitors. By upgrading their existing T1600 chassis with the T1600-TXP3DLCC-UPG-BNDL, network architects installed five SIB-TXP-3D-LCC line cards and optimized power/cooling through the bundled PWR-T-6-60-DC and FANTRAY-T4000 assemblies. Cable configuration (choosing between T1600-LCC or T4000-LCC pinouts with CB-LCC) ensured minimal trace lengths. The upgrade yielded 25% lower hop-to-hop latency, 50% reduction in link oversubscription, and guaranteed microsecond-level deterministic forwarding, directly improving trade execution speed and profitability.
Quality Certifications
To get the detailed certification, please go to the Compliance Center.
Product Comparison Table
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|---|---|---|---|---|---|
| Compatibility | Cisco, Juniper, Arista, Dell, HP | Cisco, Juniper, Arista, Dell, HP | Cisco, Juniper, Arista, Dell, HP | Cisco, Dell, HP | Cisco, Juniper, Arista, Dell, HP |
| Connector Type | SFP+ | SFP+ | SFP+ | SFP+ | SFP+ |
| Data Rate | 10Gbps | 10Gbps | 10Gbps | 10G | 10Gbps |
| Depth | N/A | 2.0 inches | N/A | 0.5 inches | N/A |
| Expansion Slots | PCIe | N/A | N/A | N/A | N/A |
| Form Factor | PCIe | PCIe | PCIe | PCIe | PCIe |
| Height | N/A | 0.5 inches | N/A | 1.0 inches | N/A |
| Input Voltage | 3.3V | 3.3V | 3.3V | 3.3V | 3.3V |
| Interface Ports | SFP+ | Ethernet | Ethernet, SFP+ | SFP+ | Ethernet |
| Max Speed | 10Gbps | 10Gbps | 10Gbps | 10Gbps | 10Gbps |
| Module Type | SFP+ | Ethernet | Ethernet | Ethernet | Ethernet |
| Operating Temperature | 0 to 70°C | 0 to 70°C | 0 to 70°C | 0 to 70°C | 0 to 70°C |
| Power Consumption | 5W | 5W | N/A | 7W | N/A |
| Product Name | SIB-TXP-3D-F13 High-Speed Network Interface Card | T1600-TXP3DLCC-UPG | T4000-TXP3DLCC-UPG | CB-LCC-S | RE-DUO-C2600-16G-BB |
| Product Type | Network Card | Network Card | Network Module / Network Card | Network Card | Network Module |
| Storage Temperature | -40 to 85°C | -40 to 85°C | -40 to 85°C | -40 to 85°C | -40 to 85°C |
| Supported Features | Auto-negotiation, Wake-on-LAN, Jumbo Frames, QoS | Auto-negotiation, Wake-on-LAN, Jumbo Frames, QoS | Auto-negotiation, Wake-on-LAN, Jumbo Frames, QoS | Auto-negotiation, Jumbo Frames, QoS | Auto-negotiation, Jumbo Frames, QoS |
| Supported Protocols | TCP/IP, Fibre Channel | TCP/IP, iSCSI, Fibre Channel | TCP/IP, iSCSI | TCP/IP, iSCSI | TCP/IP |
| Weight | N/A | 1.2 lbs | N/A | 0.2 lbs | N/A |
| Width | N/A | 3.5 inches | N/A | 3.5 inches | N/A |
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Questions & Answers
Q
What is the T1600-TXP3DLCC-UPG bundle?
A
The T1600-TXP3DLCC-UPG bundle is a factory-tested upgrade kit that converts a Cisco T1600 or T1600-LCC chassis to a TXP-3D LCC node, boosting routing capacity and 3D packet processing.
Q
Which components are included in the T1600-TXP3DLCC-UPG bundle?
A
This bundle contains five SIB-TXP-3D-LCC line cards, two PWR-T-6-60-DC power modules, two FANTRAY-T4000 assemblies, and one FAN-R-TXP-3D-LCC fan module to complete the TXP-3D LCC upgrade.
Q
What is the function of the SIB-TXP-3D-LCC cards?
A
Each SIB-TXP-3D-LCC card provides a dedicated 3D packet processor that accelerates forwarding, encryption, and deep-packet-inspection services for high-throughput deployments.
Q
Why are two PWR-T-6-60-DC modules required?
A
The two PWR-T-6-60-DC DC power supplies deliver the combined 1200 W minimum power needed to support the TXP-3D LCC line cards and associated cooling elements.
Q
What cooling components are included in the upgrade?
A
The bundle includes two FANTRAY-T4000 chassis fan trays plus one FAN-R-TXP-3D-LCC fan module to maintain optimal thermal performance for the new line cards.
Q
Do I need additional cables for the upgrade?
A
Yes. You must separately procure CB-LCC management cables and, for 8 Gbps fabric, RE-DUO-C1800-8G cables to complete the connection between the LCC and the system backplane.
Q
How does cable quantity affect T1600-LCC vs T4000-LCC designation?
A
The number of RE-DUO-C1800-8G fabric cables installed determines whether the chassis operates as a T1600-LCC (up to 4 cables) or as a full T4000-LCC (up to 8 cables).
Q
Can I use this upgrade bundle on a Cisco T4000 chassis?
A
No. The T1600-TXP3DLCC-UPG is specifically engineered for the T1600 and T1600-LCC chassis; the T4000 chassis uses a different line card and power-distribution architecture.
Q
Is a firmware update required after installing the TXP-3D LCC cards?
A
Yes. After hardware installation, you must upgrade the system software to the latest Cisco IOS XR release that supports TXP-3D LCC functionality.
Q
What is the recommended installation procedure?
A
Power down the chassis, install the five SIB-TXP-3D-LCC cards, insert the power modules and fan assemblies, attach CB-LCC and RE-DUO-C1800-8G cables, then power up and verify with CLI.
Q
How long does the upgrade process take?
A
A typical on-site upgrade takes 2 to 3 hours, including chassis power-down, hardware swaps, cable connections, software updates, and system verification.
Q
Are existing power supplies compatible with this bundle?
A
No. The TXP-3D LCC upgrade requires the PWR-T-6-60-DC modules included in the bundle; older power supplies do not meet the 600 W per slot requirement.
Q
What environmental specifications apply after the upgrade?
A
Post-upgrade, the chassis must maintain an operating temperature of 0 °C to 40 °C, relative humidity of 5 % to 85 % (non-condensing), and comply with Cisco airflow guidelines.
Q
How does this upgrade affect system throughput?
A
Upgrading to TXP-3D LCC increases per-slot throughput up to 120 Gbps and enables multi-core 3D processing for advanced services without additional hardware.
Q
What warranty covers the T1600-TXP3DLCC-UPG bundle?
A
The bundle is backed by Cisco’s limited hardware warranty and offers optional SmartNet service coverage for 24×7 technical support, parts replacement, and software updates.